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首页> 外文期刊>Journal of Micromechanics and Microengineering >Experimental studies on a novel roll-to-roll powder hot embossing for large-area fabrication of micropyramid arrays on polymers
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Experimental studies on a novel roll-to-roll powder hot embossing for large-area fabrication of micropyramid arrays on polymers

机译:对聚合物微嘧啶阵列大面积制备的新型轧辊粉末热压花的实验研究

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摘要

Roll-lo-roll (R2R) hot embossing is regarded as a cost-effective replication technology to fabricate microstructures on polymer films. However, the characteristics of continuous and fast forming for the R2R hot embossing process limits material flow during the filling stage and results in significant springback during the demolding stage. To resolve this issue, this study proposed a novel R2R powder hot embossing process, which combines the merits of the continuous fabrication of R2R hot embossing and near-net-shape forming of powder sintering and also decreases the whole cycle of the fabrication from films to microstructures. First, the relation between the molten layer thickness and processing parameters was discussed and an analytical model was established to predict the feed of the polymeric powder during R2R powder hot embossing. Then, with the use of a micro-pyramid array mold, the impact of the process parameters including mold temperature, feeding speed and applied force on the geometrical dimension of the patterned microstructures was discussed. Last, based on the response surface analysis, a process window, in terms of the mold temperature of 132 degrees C -145 degrees C, feeding speed of 0.1-1.4 m min(-1) and applied force of 15-50 kgf was determined for the continuous fabrication of completely-filled micropyramid arrays with the R2R powder hot embossing process. This research demonstrated the feasibility and superiority of the proposed R2R powder hot embossing process in continuously fabricating micropatterned structures on polymeric films.
机译:ROLL-LO-ROLL(R2R)热压花被认为是一种经济高效的复制技术,用于制造聚合物膜上的微观结构。然而,用于R2R热压花过程的连续和快速形成的特性限制了填充阶段期间的材料流动,并导致脱模阶段的显着回弹。为了解决这个问题,本研究提出了一种新型R2R粉末热压花工艺,其结合了粉末烧结的R2R热压花和近净形状的连续制备的优点,并且还降低了从薄膜制造的整个循环微观结构。首先,讨论了熔融层厚度和加工参数之间的关系,并建立了分析模型以预测R2R粉末热压花期间聚合物粉末的进料。然后,通过使用微金字塔阵列模具,讨论了包括模具温度,进给速度和施加力对图案化微结构的几何尺寸的工艺参数的影响。最后,基于响应表面分析,一个过程窗口,在模具温度为132℃-145摄氏度的方面,测定0.1-1.4 m min(-1)的进给速度和15-50kgf的施加力用于连续制造完全填充的微嘧啶阵列,具有R2R粉末热压花工艺。该研究表明了所提出的R2R粉末热压花工艺的可行性和优越性,在连续制造聚合物膜上的微型薄膜结构中。

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