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Study of high-frequency microspark-erosion of boron-doped polycrystalline diamond

机译:硼掺杂多晶硅金刚石高频微球侵蚀的研究

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摘要

The native property of weakly conductive Boron-doped polycrystalline diamond (B-doped PCD) as a high melting point, resistant, super-hard material makes it particularly difficult to machine. This paper focuses on the relative merits of eroding B-doped PCD by spark-erosion based on different power sources: commercial transistorized, Resistance-Capacitance (R-C), and designed high-frequency microspark-erosion power. Experimental results show B-doped PCD endures spark-erosion longer under commercial transistorized power although its Material-Erosion-Rate (MER) is higher. This greatly facilitates surrounding air scurries into the PCD matrix during melting and cooling. A poorer material-erosion-rate presents under R-C power due to its lower duty cycle. In contrast, dense eroded microcraters realizing a solid and regular distribution on the PCD matrix occur under high-frequency microspark-erosion power. The erosion-energy beam is supplied by a current train of high-frequency, high-peak and short-pulse-time, resulting relatively more diamond being vaporized than melted. The amount of eroded diamond is so little that debris is exceedingly slight and swiftly cleared away between each pulse-on-time. The extensive solid erosion craters resulting from the process are very useful as chip-pockets on the PCD wheel-tool for disposal of ground chips during microgrinding. Additionally, aspects relating to the merits of B-doped PCD are evaluated in detail: spark-erosion-ability (SEA) of B-doped PCD, surface roughness on B-doped PCD, depositional amounts of cobalt, and graphitization of diamond.
机译:弱导电硼掺杂多晶金刚石(B掺杂PCD)的本地性能作为高熔点,抗性,超硬材料使得机器特别困难。本文侧重于基于不同电源的火花腐蚀侵蚀B掺杂PCD的相对优点:商业跨膜,电容(R-C),设计的高频微型侵蚀功率。实验结果表明,B掺杂PCD在商业跨栏功率下持续较长的火花侵蚀,尽管其材料腐蚀速率(MER)更高。在熔化和冷却过程中,这极大地促进了围绕空气循环进入PCD基质。由于其较低的占空比,较差的材料侵蚀率在R-C电源下呈现。相比之下,在高频微型侵蚀功率下,在PCD矩阵上实现固体和常规分布的密集侵蚀的微陆。侵蚀 - 能量梁由电流高频,高峰和短脉冲时间的火车提供,导致比熔化蒸发的相对较多的钻石。侵蚀的钻石的数量很少,碎片非常轻微,并且在每个脉冲时间之间迅速地清除。由该过程产生的广泛的固体侵蚀陨石坑作为PCD轮型工具上的芯片袋非常有用,以便在微晶期间处理接地芯片。另外,与B掺杂PCD的优点有关的方面详细评估:B掺杂PCD的火花腐蚀能力(海),B掺杂PCD的表面粗糙度,沉积量的钴和金刚石的石墨化。

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