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首页> 外文期刊>Langmuir: The ACS Journal of Surfaces and Colloids >A nonlithographic top-down electrochemical approach for creating hierarchical (micro-nano) superhydrophobic silicon surfaces
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A nonlithographic top-down electrochemical approach for creating hierarchical (micro-nano) superhydrophobic silicon surfaces

机译:一种非光刻自上而下的电化学方法,用于创建分层的(微纳米)超疏水硅表面

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摘要

Superhydrophobic surfaces are biomimetic structures with potential applications in several key technological areas. In the past decade, several top-down and bottom-up fabrication methods have been developed to create such surfaces. These typically combine a hierarchical structure and low surface energy coatings to increase the contact angle and decrease the rolling angles. Silicon-based superhydrophobic surfaces are particularly attractive since they can be integrated with active electronics in order to protect them from the detrimental effects of environmental water and moisture. In this work, we introduce a simple and inexpensive process incorporating electrochemical surface modification (to create a fractal shape micro-nano topography) in combination with a final wet etching step to fabricate a superhydrophobic silicon surface with a contact angle of 160 degrees and a sliding angle of less than 1 degrees.
机译:超疏水表面是仿生结构,具有在几个关键技术领域中的潜在应用。在过去的十年中,已经开发了几种自上而下和自下而上的制造方法来创建此类表面。这些通常将分层结构和低表面能涂层结合在一起,以增加接触角并减小滚动角。硅基超疏水表面特别吸引人,因为它们可以与有源电子器件集成在一起,以保护它们免受环境水和湿气的有害影响。在这项工作中,我们介绍了一种简单而廉价的方法,该方法结合了电化学表面修饰(以创建分形的微纳米形貌)与最终的湿法蚀刻步骤相结合,以制造具有160度接触角和滑动性的超疏水硅表面角度小于1度。

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