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Cl-4(PhCN)W(NPh) as a single-source MOCVD precursor for deposition of tungsten nitride (WNx) thin films

机译:Cl-4(PhCN)W(NPh)作为用于沉积氮化钨(WNx)薄膜的单源MOCVD前驱体

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摘要

The tungsten phenylimido Complex Cl-4(PhCN)W(NPh) (2b) was tested as a single-source precursor for growth of tungsten nitride (WNx) thin films, and results were compared to films previously deposited from the isopropylimido complexes Cl-4(RCN)W((NPr)-Pr-i) (1a, R = CH3; 1b, R = Ph). Films deposited from 2b exhibited growth rates ranging from 2 to 21 Angstrom min(-1) over a temperature range of 475-750 degreesC, and the apparent activation energy for film growth in the kinetically controlled regime was 1.41+/-0.58 eV. Amorphous beta-WNx films were deposited below 500 degreesC, with minimum film resistivity and sheet resistance of 225 muOmega-cm and 75 Omega/rectangle, respectively, observed for deposition at 475 degreesC. In contrast, films deposited from the isopropylimido complexes 1a,b exhibited higher growth rates and higher nitrogen content over a similar temperature range. These differences are attributed to the higher dissociation energy of the imido N-C bond in phenylimido complex 2b. Mass spectrometry fragmentation patterns are consistent with this behavior. (C) 2003 Elsevier B.V. All rights reserved. [References: 53]
机译:测试了苯基亚氨基钨络合物Cl-4(PhCN)W(NPh)(2b)作为氮化钨(WNx)薄膜生长的单源前体,并将结果与​​先前从异丙基亚氨基络合物Cl-沉积的薄膜进行了比较4(RCN)W((NPr)-Pr-1)(1a,R = CH3; 1b,R = Ph)。从2b沉积的薄膜在475-750摄氏度的温度范围内表现出2至21埃min(-1)的生长速率,在动力学控制范围内,薄膜生长的表观活化能为1.41 +/- 0.58 eV。在低于500摄氏度的温度下沉积非晶β-WNx薄膜,在475摄氏度的沉积条件下观察到的最小薄膜电阻率和薄层电阻分别为225μOmega-cm和75Ω/矩形。相反,从异丙基亚氨基配合物1a,b沉积的膜在相似的温度范围内显示出更高的生长速率和更高的氮含量。这些差异归因于苯基亚氨基络合物2b中亚氨基N-C键的较高解离能。质谱碎片化模式与此行为一致。 (C)2003 Elsevier B.V.保留所有权利。 [参考:53]

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