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A tapered hollow metallic microneedle array using backside exposure of SU-8

机译:使用SU-8背面曝光的锥形空心金属微针阵列

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This paper presents a novel fabrication process for a tapered hollow metallic microneedle array using backside exposure of SU-8, and analytic solutions of critical buckling of a tapered hollow microneedle. An SU-8 mesa was formed on a Pyrex glass substrate and another SU-8 layer, which was spun on top of the SU-8 mesa, was exposed through the backside of the glass substrate. An array of SU-8 tapered pillar structures, with angles in the range of 3.1degrees-5degrees, was formed on top of the SU-8 mesa. Conformal electrodeposition of metal was carried out followed by a mechanical polishing using a planarizing polymeric layer. All organic layers were then removed to create a metallic hollow microneedle array with a fluidic reservoir on the backside. Both 200 mum and 400 mum tall, 10 by 10 arrays of metallic microneedles with inner diameters of the tip in the range of 33.6-101 mum and wall thickness of 10-20 mum were fabricated. Analytic solutions of the critical buckling of arbitrary-angled truncated cone-shaped columns are also presented. It was found that a single 400 Am tall hollow cylindrical microneedle made of electroplated nickel with a wall thickness of 20 mum, a tapered angle of 3.08degrees and a tip inner diameter of 33.6 mum has a critical buckling force of 1.8 N. This analytic solution can be used for square or rectangular cross-sectioned column structures with proper modifications.
机译:本文介绍了使用SU-8的背面曝光的锥形空心金属微针阵列的新型制造工艺,以及锥形空心微针的临界屈曲的解析解。 SU-8台面形成在派热克斯玻璃基板上,并在SU-8台面上方旋转的另一个SU-8层通过玻璃基板的背面露出。 SU-8台面顶部形成了一系列SU-8锥形支柱结构,其角度范围为3.1°s-5°。进行金属的共形电沉积,然后使用平坦化的聚合物层进行机械抛光。然后去除所有有机层,以形成金属空心微针阵列,在背面具有流体储存器。分别制造200毫米和400毫米高,10×10阵列的金属微针,尖端的内径在33.6-101微米范围内,壁厚为10-20微米。还提出了任意角度截断圆锥形柱的临界屈曲的解析解。已发现壁厚为20μm,锥角为3.08度,尖端内径为33.6μm,由电镀镍制成的单个高400 Am的空心圆柱形微针具有1.8 N的临界屈曲力。经过适当修改,可用于正方形或矩形截面的圆柱结构。

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