A novel fabrication process of 3D microstructures by double exposure in deep x-ray lithography ((DXRL)-X-2)

摘要

Double exposure in deep x-ray lithography ((DXRC)-X-2) was proposed for the first time to fabricate three-dimensional (3D) microstructures with inclined walls by common deep x-ray lithography (DXRL) without any special apparatus and complicated exposure process controls. The feasibility of this technique for 3D microfabrication was demonstrated by fabricating micro-projection arrays. Then, a determination procedure for important process parameters of (DXRL)-X-2, i.e., the dependence of absorbed dose on depth from a resist surface and the dependence of the dissolution rate on the absorbed dose, was proposed. By applying this procedure, the prediction of the micro-projection in (DXRL)-X-2 was carried out. It was confirmed that the processed structural shape was predicted successfully using the proposed procedure with an acceptable accuracy.