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Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

机译:通过多层深X射线光刻技术在牺牲金属层上形成微结构

摘要

Complex metal structures are formed in microminiature dimensions utilizing multiple mask exposures which are capable of producing substantially arbitrary three-dimensional shapes. A first layer of a primary metal is electroplated onto an exposed plating base to fill a void in a photoresist, the photoresist is removed, and a secondary metal, which can constitute a sacrificial metal, is electroplated over the first layer and the plating base. The exposed surface of the deposited secondary metal is then machined down to a height which exposes the first metal to produce a substantially flat, uniform surface extending across both the primary and secondary metals. The secondary metal facilitates machining of the primary and secondary metals because of these mechanical stability provided by the secondary metal to the primary metal. After the first layers of the primary and secondary metals have been machined, another photoresist layer can be applied over the primary and secondary metals, and a second layer of primary metal is electroplated. A further layer of secondary metal can be also electroplated if desired. The process of machining and electroplating can be repeated until the desired structure is formed. Secondary metal is removed by an etchant which does not etch the primary metal.
机译:利用能够产生基本上任意的三维形状的多次掩模曝光,以微小的尺寸形成复杂的金属结构。将第一层第一金属电镀到裸露的电镀基底上,以填充光致抗蚀剂中的空隙,去除光致抗蚀剂,然后在第一层和电镀基底上电镀可构成牺牲金属的第二层金属。然后将沉积的第二金属的暴露表面加工到降低第一金属的高度,以产生基本平坦,均匀的表面,该表面延伸遍及第一金属和第二金属。由于次级金属对初级金属提供的这些机械稳定性,次级金属有助于初级金属和次级金属的机械加工。在对第一和第二金属的第一层进行机加工之后,可以在第一和第二金属上施加另一光致抗蚀剂层,并电镀第二第二金属层。如果需要,还可以电镀另一层辅助金属。可以重复进行机械加工和电镀的过程,直到形成所需的结构。通过不腐蚀主要金属的腐蚀剂去除次要金属。

著录项

  • 公开/公告号EP0567332B1

    专利类型

  • 公开/公告日1996-06-26

    原文格式PDF

  • 申请/专利权人 WISCONSIN ALUMNI RESEARCH FOUNDATION;

    申请/专利号EP19930303140

  • 发明设计人 GUCKEL HENRY;

    申请日1993-04-22

  • 分类号C25D5/02;C23F1/02;G03F7/00;

  • 国家 EP

  • 入库时间 2022-08-22 03:47:44

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