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Effects of rapid thermal treatments on the electrical properties of thin SiO2 gate oxide for DRAM p-channel MOS transistors

机译:快速热处理对DRAM p沟道MOS晶体管薄SiO2栅极氧化物的电性能的影响

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摘要

Silicon oxide has been grown by rapid thermal processing. The growth rate, in the range of very thin films (<10 nm), has been studied as a function of the oxidation temperature. Combined films composed by conventional thermal silicon oxide growth over SiO2 passivation layer deposited by rapid thermal processing onto Si(1 0 0) substrates have been used as gate oxide of p-channel metal-oxide semiconductor (p-MOS) transistors of dynamic random access memory (DRAM). The effect of rapid thermal annealing treatments on these films has also been experimented. Improvements in the electrical performances of transistors have been observed. (C) 2001 Elsevier Science B.V. All rights reserved. [References: 9]
机译:氧化硅已经通过快速热处理生长。已经研究了在非常薄的薄膜(<10 nm)范围内的生长速率与氧化温度的关系。由传统的热氧化硅在SiO2钝化层上生长形成的组合膜已被用作动态随机存取的p沟道金属氧化物半导体(p-MOS)晶体管的栅极氧化物,该组合物通过快速热处理沉积到Si(1 0 0)衬底上而在SiO2钝化层上生长内存(DRAM)。快速热退火处理对这些膜的影响也已经进行了实验。已经观察到晶体管的电性能的改善。 (C)2001 Elsevier Science B.V.保留所有权利。 [参考:9]

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