首页> 外国专利> Method of making an ultrathin silicon dioxide gate with improved dielectric properties using NH3 nitridation and post-deposition rapid thermal annealing

Method of making an ultrathin silicon dioxide gate with improved dielectric properties using NH3 nitridation and post-deposition rapid thermal annealing

机译:利用NH 3 氮化和沉积后快速热退火制备具有改善的介电性能的超薄二氧化硅栅极的方法

摘要

A method of making a semiconductor device having a silicon dioxide based gate with improved dielectric properties including providing a silicon based substrate having active areas defined therein. Thermally growing a silicon dioxide based gate from the silicon based substrate. Nitriding the silicon dioxide based gate to provide a nitrided silicon dioxide based gate and to increase the dielectric constant of the silicon dioxide based gate without substantially increasing thickness of the silicon dioxide based gate.
机译:一种制造具有具有改善的介电特性的基于二氧化硅的栅极的半导体器件的方法,包括提供具有在其中限定的有源区的基于硅的衬底。从基于硅的衬底热生长基于二氧化硅的栅极。氮化基于二氧化硅的栅极以提供氮化的基于二氧化硅的栅极并在不实质上增加基于二氧化硅的栅极的厚度的情况下增加基于二氧化硅的栅极的介电常数。

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