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A non-volatile MOSFET memory device based on mobile protons in SiO_2 thin films

机译:一种基于移动质子的SiO_2薄膜非易失性MOSFET存储器件

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摘要

It is shown how mobile H~+ ions can be generated thermally inside the oxide layer of Si/SiO_2/Si structures. The technique involves only standard silicon processing steps: the non-volatile field effect transistor (NVFET) is based on a standard MOSFET with thermally grown SiO_2 capped with a poly-silicon layer. The capped thermal oxide receives an anneal at approx 1100 deg C that enables the incorporation of the mobile protons into the gate oxide. The introduction of the protons is achieved by a subsequent 500-800 deg C anneal in a hydrogen-containing ambient, such as forming-gas (N_2: H_2 95:5). The mobile protons are stable and entrapped inside the oxide layer, and unlike alkali ions, their space-charge distribution can be controlled and rearranged at room temperature by an applied electric field. Using this principle, a standard metal-oxide-semiconductor (MOS) transistor can be converted into a non-volatile memory transistor that can be switched between 'normally on' and 'normally off. Switching speed, retention, endurance, and radiation tolerance data are presented showing that this non-volatile memory technology can be competitive with existing Si-based non-volatile memory technologies such as the floating gate technologies (e.g. Flash memory).
机译:显示了如何在Si / SiO_2 / Si结构的氧化物层内部热生成可移动的H〜+离子。该技术仅涉及标准的硅处理步骤:非易失性场效应晶体管(NVFET)基于标准的MOSFET,其中的热生长SiO_2被多晶硅层覆盖。封盖的热氧化物在大约1100摄氏度下接受退火,这使可移动质子并入栅极氧化物中。质子的引入是通过随后在含氢的环境(如形成气(N_2:H_2 95:5))中进行500-800摄氏度的退火来实现的。可移动质子是稳定的并且被截留在氧化物层内部,与碱金属离子不同,它们的空间电荷分布可以在室温下通过施加电场来控制和重新排列。使用此原理,可以将标准的金属氧化物半导体(MOS)晶体管转换为非易失性存储晶体管,该晶体管可以在“正常导通”和“正常截止”之间切换。给出的开关速度,保持力,耐久性和辐射耐受性数据表明,该非易失性存储技术可以与现有的基于Si的非易失性存储技术(例如浮栅技术(例如闪存))竞争。

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