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首页> 外文期刊>Journal of Electronic Materials >Effect of Nitridation on the Regrowth Interface of AlGaN/GaN Structures Grown by Molecular Beam Epitaxy on GaN Templates
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Effect of Nitridation on the Regrowth Interface of AlGaN/GaN Structures Grown by Molecular Beam Epitaxy on GaN Templates

机译:氮化对分子束外延生长在GaN模板上的AlGaN / GaN结构再生界面的影响

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AlGaN/GaN structures were regrown on GaN templates using plasma-assisted molecular beam epitaxy (PA-MBE). Prior to the regrowth, nitridation was performed using nitrogen plasma in the MBE chamber for different durations (0 min to 30 min). Direct-current measurements on high-electron-mobility transistor devices showed that good pinch-off characteristics and good interdevice isolation were achieved for samples prepared with a 30-min nitridation process. Current-voltage measurements on Schottky barrier diodes also revealed that, for samples prepared without nitridation, the reverse-bias gate leakage current was approximately two orders of magnitudes larger than that of samples prepared with a 30-min nitridation process. The improvement in the electrical properties is a result of contaminant removal at the regrowth interface which may be induced by the etching effect of nitridation.
机译:使用等离子辅助分子束外延(PA-MBE)在GaN模板上重新生长AlGaN / GaN结构。在再生之前,使用MBE室中的氮等离子体进行氮化持续不同的时间(0分钟至30分钟)。在高电子迁移率晶体管器件上进行的直流测量表明,采用30分钟氮化工艺制备的样品具有良好的夹断特性和良好的器件间隔离性。肖特基势垒二极管的电流电压测量结果还表明,对于未经氮化处理的样品,反向偏置栅极泄漏电流比经过30分钟氮化处理的样品大约两个数量级。电性能的改善是在再生界面去除污染物的结果,这可能是由于氮化的蚀刻作用引起的。

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