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Analysis of traps in high quality CVD diamond films through the temperature dependence of carrier dynamics

机译:通过载流子动力学的温度依赖性分析高质量CVD金刚石膜中的陷阱

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摘要

The analysis of the time behavior of pulses generated by CVD diamond films irradiated with alpha-particles has been recently shown to be a general and powerful tool to investigate trap properties in diamond films (M.Marinelli et al.,Phys.Rev.B 64 (2001) 195205).We use here this technique to measure the activation energy of traps in CVD diamond films,through the analysis of the temperature dependence of the dynamics of carriers generated by alpha-particle irradiation.The samples used in this study are high quality films deposited in a microwave tubular reactor and show very narrow diamond Raman peaks (FWHM approximately 2.4 cm~(-1)) and extremely low photoluminescence background.The time evolution of the response of alpha-particle detectors built from these films exhibit both a fast and a slow component.Quantitative analysis leads to the conclusion that only deep traps limit the electron mean free path before trapping,while for holes both deep and shallow centers must be taken into account,the latter becoming the limiting factor in the pumped state.The changes in the pulse shapes are analyzed when the film temperature T is varied from -40 to 20 deg C.A systematic speed-up of the response is found with increasing temperature,confirming that the slow component is due to thermally activated detrapping from the relative shallow defects.The detrapping time constant tau~D is connected to the activation energy E_D of the defects through the formula 1/tau~D=s exp(-E_d/kT),where s is the attempt frequency.Plotting ln (tau~D) vs.1/T allows to determine the activation energy of the shallow defects,which is found to be 0.35 eV.
机译:最近已证明,对用α粒子辐照的CVD金刚石膜产生的脉冲的时间行为进行分析是研究金刚石膜陷阱性质的通用且功能强大的工具(M.Marinelli等,Phys.Rev.B 64 (2001)195205)。通过分析α粒子辐照产生的载流子动力学的温度依赖性,我们在此使用此技术来测量CVD金刚石膜中陷阱的活化能。高质量的薄膜沉积在微波管式反应器中,并显示出非常窄的菱形拉曼峰(FWHM约为2.4 cm〜(-1))和极低的光致发光背景。由这些薄膜构建的α粒子探测器的响应时间演化显示出定量分析得出的结论是,只有深陷阱限制了陷阱之前的电子平均自由程,而对于深,浅中心的空穴都必须考虑薄膜温度T在-40至20度CA变化时,分析了脉冲形状的变化,发现随着温度的升高系统地加快了响应速度。缓慢的成分是由于相对浅的缺陷被热激活的去陷阱引起的。去陷阱时间常数tau〜D通过公式1 / tau〜D = s exp(-E_d / kT)与缺陷的激活能E_D相关,将ln(tau〜D)与1 / T作图可以确定浅层缺陷的激活能,发现其为0.35 eV。

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