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Electron-assisted deposition of cubic boron nitride by r.f. magnetron sputtering

机译:射频电子辅助沉积立方氮化硼磁控溅射

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摘要

Cubic boron nitride (cBN) has been deposited on silicon (100) substrates by means of radio frequency (r.f.) magnetron sputtering in nitrogen using a hexagonal boron nitride target with the assistance of a simultaneous electron bombardment of thegrowing surface. Unlike most thin-film deposition processes for cBN, intentional bombardment of the growing surface by ion beams within specific ranges in energy and flux is not required for this process to achieve high-purity cBN films. Fourier transform infra-red (FTIR) spectra of cBN films show a strong absorption band around 1070 cm{sup}(-1). With electrons bombarding the growing surface at a current density of 140 mA cm{sub}(-2) or higher, pure (according to FTIR spectra) cBN films are deposited onsilicon substrates at temperatures above 750℃. The effects of electron current density and nitrogen gas pressure on the synthesis of cBN films will be discussed.
机译:立方氮化硼(cBN)已通过六方氮化硼靶在氮气中进行射频(r.f.)磁控溅射在氮气中进行射频(r.f.)磁控溅射,并同时对生长表面进行电子轰击而沉积在硅(100)基板上。与大多数cBN薄膜沉积工艺不同,此过程不需要离子束在能量和通量的特定范围内故意轰击生长表面,即可获得高纯度cBN膜。 cBN薄膜的傅立叶变换红外(FTIR)光谱在1070 cm {sup}(-1)附近显示出很强的吸收带。随着电子以140 mA cm {sub}(-2)或更高的电流密度轰击生长的表面,在750℃以上的温度下,纯的(根据FTIR光谱)cBN膜沉积在硅衬底上。将讨论电子电流密度和氮气压力对cBN薄膜合成的影响。

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