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Effects of post-deposition annealing ambient on band alignment of RF magnetron-sputtered Y2O3 film on gallium nitride

机译:沉积后退火环境对氮化镓上射频磁控溅射Y2O3薄膜能带取向的影响

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摘要

The effects of different post-deposition annealing ambients (oxygen, argon, forming gas (95% N2 + 5% H2), and nitrogen) on radio frequency magnetron-sputtered yttrium oxide (Y2O3) films on n-type gallium nitride (GaN) substrate were studied in this work. X-ray photoelectron spectroscopy was utilized to extract the bandgap of Y2O3 and interfacial layer as well as establishing the energy band alignment of Y2O3/interfacial layer/GaN structure. Three different structures of energy band alignment were obtained, and the change of band alignment influenced leakage current density-electrical breakdown field characteristics of the samples subjected to different post-deposition annealing ambients. Of these investigated samples, ability of the sample annealed in O2 ambient to withstand the highest electric breakdown field (approximately 6.6 MV/cm) at 10−6 A/cm2 was related to the largest conduction band offset of interfacial layer/GaN (3.77 eV) and barrier height (3.72 eV).
机译:不同的沉积后退火环境(氧气,氩气,形成气体(95%N2 + 5%H2)和氮气)对n型氮化镓(GaN)上射频磁控溅射氧化钇(Y2O3)膜的影响对这项工作进行了研究。利用X射线光电子能谱法提取了Y2O3和界面层的带隙,并建立了Y2O3 /界面层/ GaN结构的能带取向。获得了三种不同的能带取向结构,并且能带取向的变化影响了在不同的沉积后退火环境下样品的漏电流密度-电击穿场特性。在这些调查样本中,在O2环境中退火的样本在10 -6 A / cm 2 时承受最高击穿电场(大约6.6 MV / cm)的能力为与界面层/ GaN的最大导带偏移(3.77 eV)和势垒高度(3.72 eV)有关。

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