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Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

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1.A parametric study of flip chip reliability based on solder fatiguemodelling

机译：基于焊接疲劳的倒装芯片可靠性参数研究造型
- 作者：Popelar S.F.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
2.Macro model development as a bridge between factory levelsimulation and LP enterprise systems

机译：宏模型开发是工厂级之间的桥梁模拟和LP企业系统
- 作者：Allison R.A.H.;Yu J.;Li-Hui Tsai;Chihwei Liu;Drummond M.;Kayton D.;Sustae T.;Witte J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
3.A study of wafer fab dispatching rules based on empirical flow timepredictions

机译：基于经验流时间的晶圆厂调度规则研究预测
- 作者：Yi-Feng Hung;Ching-Bin Chang
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
4.A graph-based disassembly sequence planning for EOL productrecycling

机译：EOL产品的基于图的拆卸顺序计划回收利用
- 作者：Zhang H.C.;Kuo T.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
5.Statistical machine control: a practical approach to totalproductive maintenance of semiconductor equipment

机译：统计机器控制：一种实用的总计方法半导体设备的生产维护
- 作者：Lavallart F.;Cooper N.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
6.A fracture mechanics analysis of the popcorn cracking in theplastic IC packages

机译：爆米花裂纹的断裂力学分析。塑料IC封装
- 作者：Park Y.B.;Jin Yu
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
7.Thermal enhancement and reliability of 40 mm EPBGA packages withinterface materials

机译：40 mm EPBGA封装的热增强和可靠性界面材料
- 作者：Celik Z.Z.;Copeland D.;Mertol A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
8.Assembly and reliability of thermally enhanced high I/O BGApackages

机译：散热增强的高I / O BGA的组装和可靠性包装
- 作者：Ejim T.I.;Hollesen D.B.;Holliday A.;Gahr S.A.;Coyle R.J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
9.A versatile pick and place tool for ultrapreciseplacement-demonstrated by the application in an advanced MCM-Dtechnology

机译：多功能的取放工具，可实现超高精度应用程序在高级MCM-D中展示的位置技术
- 作者：Guide P.;Bornholdt O.;Neumann G.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
10.Using contract manufacturing services to assist with designsolutions in advanced packaging technologies

机译：使用合同制造服务来协助设计先进包装技术的解决方案
- 作者：Toth G.A.;Hyora R.W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
11.ViperBGA: a novel design approach to high performance and highdensity BGA's

机译：ViperBGA：一种新颖的设计方法，可实现高性能和高性能密度BGA
- 作者：Wu P.;Chen K.;Tzou J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
12.An organic and ceramic laminated BGA package with high thermal andelectrical performance characteristics

机译：有机和陶瓷叠层BGA封装，具有高散热和电气性能特征
- 作者：Asai H.;Yano K.;Iyogi K.;Iwase N.;Fujiwara T.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
13.Addressing environment, health and safety in semiconductor processdevelopment

机译：解决半导体工艺中的环境，健康和安全问题发展
- 作者：Mendicino L.;Beu L.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
14.Assessment of failure rate of printed board assemblies by the hightemperature accelerated life test

机译：通过高评估板故障率温度加速寿命测试
- 作者：Choong-Reol Young;Jae-Nyun Yoo
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
15.Integrated development and manufacturing methodology for advancedpower MOSFETs

机译：先进的集成开发和制造方法功率MOSFET
- 作者：Kasem M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
16.Implementation of overall equipment effectiveness (OEE) system at asemiconductor manufacturer

机译：实施整体设备效率（OEE）系统半导体制造商
- 作者：Giegling S.;Verdini W.A.;Haymon T.;Konopka J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
17.The use of concentrated hydrogen peroxide for the removal of a TiWARC from aluminum bond pads

机译：使用浓过氧化氢去除TiW铝焊垫的电弧
- 作者：Danzl R.B.;McLaurin A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
18.Development of an ultra low moisture polymer adhesive for dieattach applications

机译：开发用于模具的超低水分聚合物粘合剂附加申请
- 作者：Nguyen M.N.;Chien I.Y.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
19.Moisture absorption and autoclave performance optimization of globtop ball grid array

机译：球的吸湿和高压灭菌性能优化顶球网格阵列
- 作者：Thompson T.A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
20.High performance ball grid array utilizing flip chip bonding onbuildup printed circuit board

机译：利用倒装芯片键合的高性能球栅阵列积层印刷电路板
- 作者：Yamanaka K.;Mori H.;Tsukada Y.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
21.The study of the response of solder pastes under sinusoidalvibration

机译：正弦曲线下锡膏响应的研究振动
- 作者：He D.;Ekere N.N.;Currie M.A.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
22.The impact of tool delivery times on the optimal capacity and valueof semiconductor wafer fabs

机译：工具交付时间对最佳产能和价值的影响半导体晶圆厂
- 作者：Wood S.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
23.Automated adaptive control of the reflow soldering of electronicassemblies

机译：电子回流焊的自动自适应控制组件
- 作者：Conway P.P.;Whalley D.C.;Wilkinson M.;Williams D.J.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
24.Development of tapeless lead-on-chip (LOC) packaging process withi-line photosensitive polyimide

机译：开发带式无带芯片引线（LOC）封装工艺i-line光敏聚酰亚胺
- 作者：Amagai M.;Saitoh T.;Ohsumi M.;Kawasaki E.;Yew C.K.;Chye L.T.;Toh J.;Swee Yang Khim
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
25.Lifetime assessment of soft solder joints on the base of themetallurgical behaviour of Sn₆₂Pb₃₆Ag₂

机译：基于焊点寿命的软焊点评估Sn _{62 Pb _{36 Ag _{2 的冶金行为}}}
- 作者：Grossmann G.;Weber L.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
26.Beyond refractive optical lithography next generation lithography“What's after 193 nm?”

机译：超越折射光学光刻技术的下一代光刻技术“ 193 nm之后是什么？”
- 作者：Seidel P.;Canning J.;Mackay S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
27.Effect of substrate warpage on the second level assembly ofadvanced plastic ball grid array (PBGA) packages

机译：基板翘曲对第二级组装的影响先进的塑料球栅阵列（PBGA）封装
- 作者：Bhogeswara Rao D.;Prakash M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
28.Evaluating the manufacturability of GaAs/AlGaAs multiple quantumwell avalanche photodiodes using neural networks

机译：评估GaAs / AlGaAs多量子的可制造性使用神经网络的雪崩光电二极管
- 作者：Ilgu Yun;May G.S.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
29.Significance of coating stress on substrate bow in large areaprocessing of MCM

机译：大面积基体弓上涂层应力的意义MCM的处理
- 作者：Kwanho Yang;Jang-Hi Im;Heistand R.H.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
30.Thick-film intelligent sensors using new Du Pont and ESL hightechnology materials

机译：使用新型Du Pont和ESL high的厚膜智能传感器技术资料
- 作者：Fitt J.;Gondek J.J.;Parzelka Z.;Zaraska W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
31.Ground connection soldering techniques of high density ceramicssubstrate of transmit/receive module and its reliability

机译：高密度陶瓷的接地焊接技术收发模块的基板及其可靠性
- 作者：Wang Tingyue;Cui Dianheng;Yu Shenlin;Tang Jun;Yan Wei
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
32.Improvement of microassemblies ultrasonic images using adaptedsignal processing techniques

机译：使用改进的微组件超声图像信号处理技术
- 作者：Bechou L.;Ousten Y.;Tregon B.;Danto Y.;Salagoity M.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
33.Automated isostatic lamination of green sheets in multilayerelectric components

机译：多层印刷电路板的自动等静压层压电气元件
- 作者：Kaminaga K.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
34.Cost considerations for integrating flip chip and chip on boardtechnologies into high volume manufacturing areas

机译：集成倒装芯片和板上芯片的成本考虑技术进入大批量生产领域
- 作者：Roney R.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
35.Silicon device pad design considerations for solder flip chipapplications

机译：焊料倒装芯片的硅器件焊盘设计注意事项应用领域
- 作者：Kubin R.;Ho V.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
36.Recipe generation for large-area meniscus coating using Kalmanfilter estimation

机译：使用卡尔曼的大面积半月板涂层配方生成滤波器估计
- 作者：Krauss A.F.;Kamen E.W.;Chng C.M.;The A.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
37.The total process cost of selective epitaxial growth (SEG)dielectric isolation process as compared to LOCOS

机译：选择性外延生长（SEG）的总工艺成本与LOCOS相比，介电隔离工艺
- 作者：Hughes J.G.;Neudeck G.W.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
38.Author Index

机译：作者索引
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
39.Rheological techniques for measuring normal stress differences ofsolder paste PCBs

机译：流变学技术测量法向应力差锡膏PCB
- 作者：Riedlin M.H.A.;Ekere N.N.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
40.Web-based tools in support of life cycle engineering oftelecommunications products

机译：基于Web的工具支持生命周期工程电信产品
- 作者：Palmer P.J.;Williams D.J.;Dixon A.C.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》
41.The effects of flux materials on the moisture sensitivity andreliability of flip chip on board assemblies

机译：助焊剂材料对水分敏感性和倒装板上组装的可靠性
- 作者：Beddingfield C.;Higgins L. III.
- 会议名称：《Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International》