Ground connection soldering techniques of high density ceramicssubstrate of transmit/receive module and its reliability

摘要

The operation frequency of Transmit/Receive (T/R) module foractive phased-array radar is very high (at least above 1000 MHz). Theground connection between the back side metal plating of the functionalelements and the substrate carrier of the T/R module is so importantthat it can directly affect the performance and reliability of thefunctional elements and T/R module. In this paper, the followingtechniques are studied: conduction and reliability of the via holebetween top side and back side of the thin film or thick film microwavecircuit substrate, control of soldering stress and deformations;solderability of available materials; and soldering processingtechnology. Highly reliable T/R modules are successfully manufactured byusing soldering in place of screws