Thermal enhancement and reliability of 40 mm EPBGA packages withinterface materials

摘要

Increasing power requirements for Plastic Ball Grid Array (PBGA)packages demand better thermal management for increased performance andreliability. One of the important parameters that affect the rate ofthermal dissipation is the thermal resistance between the packagesurface and the heat sink. An Enhanced PBGA package of 40 mm ×40mm body size with an Intricast plate fin heat sink was used to evaluatecommercially available interface materials. Junction-to-ambientresistance of the package and the base temperature at the center of theheat sink was measured with respect to air velocity. Thermal cycling wascarried out to determine the long term effects on the the thermalperformance. In addition to experiments, a computational model was alsoused. Relative performance of interface materials was determined