Fast and accurate quasi-three-dimensional capacitance determinationof multilayer VLSI interconnects

摘要

A new fast and accurate capacitance determination methodology fornintricate multilayer VLSI interconnects is presented. Since a multilayerninterconnect structure is too complicated to be directly tractable, itnis simplified by investigating charge distributions within the system.nThe quasi-three-dimensional (3-D) capacitances of the structure are thenndetermined by combining a set of solid-ground-based two-dimensionaln(2-D) capacitances and shielding effects that can be independentlyncalculated from the simplified structure. The shielding effects due tonthe neighboring lines of a line can be analytically determined from thengiven layout dimensions. The solid-ground-based 2-D capacitances cannalso be quickly computed from the simplified structure. Thus, thenproposed capacitance determination methodology is much morencost-efficient than conventional 3-D-based methods. It is shown that thencalculated quasi-3-D capacitances have excellent agreement with 3-Dnfield-solver-based results within 5% error