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A 256-kb 9T Near-Threshold SRAM With 1k Cells per Bitline and Enhanced Write and Read Operations

机译:256-kb 9T近阈值SRAM,每个位线具有1k单元,并具有增强的读写操作

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In this paper, we present a new 9T SRAM cell that has good write ability and improves read stability at the same time. Simulation results show that the proposed design increases read static noise margin and of read path by 219% and 113%,respectively, at supply voltage of 300-mV over conventional 6T SRAM cell in a 90-nm CMOS technology. The proposed design lets us reduce the minimum operating voltage of SRAM () to 350 mV, whereas conventional 6T SRAM cannot operate successfully with an acceptable failure rate at supply voltages below 725 mV. We also compared our design with three other SRAM cells from recent literature. To verify the proposed design, a 256-kb SRAM is designed using new 9T and conventional 6T SRAM cells. Operating at their minimum possible , the proposed design decreases write and read power per operation by 92% and 93%, respectively, over the conventional rival. The area of the proposed SRAM cell is increased by 83% over a conventional 6T one. However, due to large of read path for 9T cell, we are able to put 1k cells in each column of 256-kb SRAM block, resulting in the possibility for sharing write and read circuitries of each column between more cells compared with conventional 6T. Thus, the area overhead of 256-kb SRAM based on new 9T cell is reduced to 37% compared with 6T SRAM.
机译:在本文中,我们提出了一种新型9T SRAM单元,该单元具有良好的写入能力并同时提高了读取稳定性。仿真结果表明,与采用90nm CMOS技术的传统6T SRAM单元相比,在300mV的电源电压下,所提出的设计分别将读取静态噪声容限和读取路径增加219%和113%。提出的设计使我们能够将SRAM()的最小工作电压降低到350 mV,而传统的6T SRAM在低于725 mV的电源电压下无法以可接受的故障率成功运行。我们还将我们的设计与最新文献中的其他三个SRAM单元进行了比较。为了验证建议的设计,使用新的9T和传统的6T SRAM单元设计了256-kb SRAM。与常规竞争对手相比,建议的设计以最小的工作功耗,每操作的写和读功率分别降低了92%和93%。所提出的SRAM单元的面积比传统的6T单元增加了83%。但是,由于9T单元的读取路径很大,我们能够在256-kb SRAM块的每一列中放置1k个单元,与传统的6T相比,可以在更多单元之间共享每一列的写和读电路。因此,与6T SRAM相比,基于新的9T单元的256-kb SRAM的区域开销减少到了37%。

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