Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering

摘要

The laser has been utilized as a alternative heat source for the soldering process because of its unique properties such as localized heating, rapid rise and fall in temperature, non-contact heating and easily automated process. However, there is limited discussion of the laser reflow soldering and a lack of information exists about the performance of the resultant joints. In this study, the impact strength of Sn-Ag-Cu solder joints in electroless Ni-P/Au plating in laser reflow soldering was investigated using a ball impact test. As a result, it has been made clear that the impact strength of the solder bumps was affected by the heat source for the soldering process.