ELECTROLESS Ni-P PLATING SOLUTION AND ELECTROLESS Ni-P PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless Ni-P plating solution and method, capable of easily managing a solution, stabilizing the composition of a plating film and forming a Ni-P alloy plating film excellent in corrosion resistance with fast deposition rate and good workability.;SOLUTION: The electroless Ni-P plating solution comprises: water-soluble nickel sa hypophosphorous acid or its sa at least one kind of complexing agents selected from a group consisting of dicarboxylic acid, oxycarbonic acid and aminocarboxylic acid; quarternary ammonium sa and ions of at least one kind of metals selected from a group consisting of Mo, Sb, Mn and Ti or oxide ions of the metal.;COPYRIGHT: (C)2015,JPO&INPIT