ELECTROLESS Ni-P PLATING LIQUID AND ELECTROLESS Ni-P PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless Ni-P plating liquid and a plating method for favorably incorporating CNT having a large size such as VGCF (R) into a plating film.;SOLUTION: In the electroless Ni-P plating liquid, a trimethylcetyl ammonium salt, preferably trimethylcetyl ammonium chloride, is used as a dispersant of VGCF (R) (commercially available carbon nanotube in a large size about 150 nm in diameter and 10 to 20 μm in length) in the plating liquid. The plating method for Ni-P plating is implemented by using the plating liquid.;COPYRIGHT: (C)2010,JPO&INPIT