SOLDER FOR NICKEL-PLATED SURFACE BY ELECTROLESS PLATING, FOR FORMING SOLDER JOINT FIRMLY COMBINED TO ELECTRODE PAD OF SUBSTRATE FOR ELECTRONIC COMPONENTS BY ELECTROLESS PLATING

摘要

PROBLEM TO BE SOLVED: To solve the problem that, though soldering has heretofore been performed with a solder alloy having a composition in the vicinity of an Sn-Pb eutectic in a BGA (Ball Grid Array) substrate and a printed circuit board coated with electroless Ni plating, if electric appliances incorporated with these substrates or the like are subjected to strong impact, the soldered parts are easily peeled.;SOLUTION: The solder alloy has resistance to peeling when a soldering part subjected to electroless Ni plating is soldered, and is composed by adding, by mass, 0.002 to 0.01% P and 0.04 to 0.3% Cu to a solder alloy having a composition in the vicinity of an Sn-Pb eutectic comprising 60 to 64% Sn, and the balance Pb.;COPYRIGHT: (C)2004,JPO