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Analysis of trap distribution in polysilicon channel transistors using the variable amplitude charge pumping method

机译:可变幅度电荷泵方法分析多晶硅沟道晶体管中的陷阱分布

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摘要

The trap distribution of a polysilicon (poly-Si) channel in a metal-oxide-semiconductor field effect transistor (MOSFET) was extracted successfully using a variable amplitude charge pumping method (VACP) and an energy band bending model. Compared to single crystal Si channels, the poly-Si channels exhibited a high density of bulk channel traps due to the presence of grain boundaries. The densities of the trap states existing in the poly-silicon channel with various grain sizes and channel thicknesses were extracted and compared. The grain size of poly-Si was found to have a stronger impact on the trap distribution than the channel thickness. After hot carrier stress, the trap density in the poly-silicon channel increases and the generated traps are located both at mid gap energy level and near the conduction band energy level.
机译:使用可变幅度电荷泵方法(VACP)和能带弯曲模型,成功地提取了金属氧化物半导体场效应晶体管(MOSFET)中多晶硅(poly-Si)沟道的陷阱分布。与单晶硅沟道相比,由于存在晶界,多晶硅沟道表现出高密度的体沟道陷阱。提取并比较存在于具有各种晶粒尺寸和沟道厚度的多晶硅沟道中的陷阱态的密度。发现多晶硅的晶粒尺寸对陷阱分布的影响大于沟道厚度。在热载流子应力之后,多晶硅沟道中的陷阱密度增加,并且所产生的陷阱既位于中间能隙能级,又位于导带能级附近。

著录项

  • 来源
    《Solid-State Electronics》 |2015年第2期|86-89|共4页
  • 作者单位

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

    Process Development P/J 2, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San #16 Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, Republic of Korea;

    Process Development P/J 2, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San #16 Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, Republic of Korea;

    Process Development P/J 2, Semiconductor R&D Center, Samsung Electronics Co., Ltd., San #16 Banwol-Dong, Hwasung-City, Gyeonggi-Do 445-701, Republic of Korea;

    Department of Materials Sci. &Eng., Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Polysilicon; Charge pumping; Channel trap density; Trap distribution; Grain size effect; Hot carrier injection;

    机译:多晶硅电荷泵;通道陷阱密度;陷阱分布;粒度效应;热载流子注入;

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