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首页> 外文期刊>Physica status solidi >The Effect Of Crystallization Technology And Gate Insulator Deposition Method On The Performance And Reliability Of Polysilicon Tfts
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The Effect Of Crystallization Technology And Gate Insulator Deposition Method On The Performance And Reliability Of Polysilicon Tfts

机译:结晶技术和栅极绝缘子沉积方法对多晶硅晶体管性能和可靠性的影响

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摘要

Polysilicon TFTs were fabricated using solid phase crystallization (SPC) and also two different excimer laser annealing techniques (ELA) for polysilicon crystallization. Moreover, we tried two different gate oxide deposition methods, using PECVD or TEOS LPCVD. Comparing the characteristics of the fabricated TFTs, we were able to probe the effects of the polysilicon crystallization techniques and the gate oxide deposition methods on TFT performance and reliability. This way, an optimization of the TFT fabrication procedure could be possible.
机译:多晶硅TFT是使用固相结晶(SPC)以及两种不同的准分子激光退火技术(ELA)制造的,用于多晶硅结晶。此外,我们尝试了两种不同的栅极氧化物沉积方法,即使用PECVD或TEOS LPCVD。比较制成的TFT的特性,我们能够探究多晶硅结晶技术和栅极氧化物沉积方法对TFT性能和可靠性的影响。这样,可以优化TFT制造过程。

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