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Experimental measurement of in-depth secondary defects distribution produced by helium implantation in silicon

机译:硅中氦注入产生的深度二次缺陷分布的实验测量

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The effect of lifetime engineering processes on the electrical behaviour of electronic devices is related to the stable defects concentration that establishes in the semiconductor material. The modelling of such processes is complicate because the mechanisms leading from primary defects (the ones directly created by the process) to secondary ones (arising from the interactions between primary defects themselves and between primary defects and other impurities present in the material) depend, in an unpredictable way, on the microscopic structure of each particular material. In this paper we present an experimental study showing the distribution of secondary defects created by an helium implantation process. The defects are characterised in terms of energy levels, effectiveness, and concentration. A comparison with the distribution predicted by the TRIM code is also given.
机译:生命周期工程过程对电子设备电性能的影响与半导体材料中稳定的缺陷浓度有关。这样的过程的建模是复杂的,因为从主要缺陷(由过程直接创建的那些缺陷)到次要缺陷(由主要缺陷本身之间以及主要缺陷与材料中存在的其他杂质之间的相互作用引起)的次级机理所依赖的机理取决于:每种特定材料的微观结构上的一种不可预测的方式。在本文中,我们进行了一项实验研究,显示了由氦注入过程产生的次级缺陷的分布。缺陷的特征在于能级,有效性和集中度。还给出了与TRIM代码预测的分布的比较。

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