Reliability study of the assembly of a large BGA on a build up board using thermo-mechanical simulations

摘要

In a full array PBGA (Plastic Ball Grid Array), the location of the most stressed ball is reported to be under the die, at the die's edge or at the package's corner, depending on various parameters such as the substrate thickness, used materials, and so on. Thermo-mechanical simulations of such assemblies can help analysing the impact of these parameters on the global reliability of the assembly. The importance of residual stresses, stored in the assembly during the reflow process, can also be evaluated.