Assembly Reliability of BGAs and Effects of Board Finish

机译：BGa的装配可靠性和板面效果

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This paper will present failure characteristics of the assemblies up to 7,000 cycles.

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作者
Ghaffarian, R.;
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年度 1999
页码 1-9
总页数 9
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
CYCLES; FAILURE; RELIABILITY; SOLDERS; SURFACE FINISHING; THERMAL CYCLING TESTS; Solder Joint Reliability BGA Ball Grid Array Thermal Cycling Surface finish SMT;

机译：循环;失败;可靠性;焊料;表面处理;热循环测试;焊点可靠性BGa球栅阵列热循环表面处理smT;

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专利

1. Reliability study of the assembly of a large BGA on a build up board using thermo-mechanical simulations [J] . P. Guilbault, E. Woirgard, C. Zardini, Microelectronics & Reliability . 2002,第9a11期

机译：使用热机械模拟对大型BGA在组装板上进行组装的可靠性研究
2. Reliability study of the assembly of a large BGA on a build up board using thermo-mechanical simulations. [J] . P. Guilbault, E. Woirgard, C. Zardini Microelectronics & Reliability . 2002,第9a11期

机译：使用热机械模拟对大型BGA在组装板上进行组装的可靠性研究。
3. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION [J] . 史训清, John HL Pang, 杨前进, 力学学报：英文版 . 2002,第004期

机译：球栅阵列（BGA）组装中焊点可靠性的快速评估方法-第二部分：可靠性实验与数值模拟
4. Assembly reliability of BGAs and effects of board finish [C] . Reza Ghaffarian NEPCON west technical program conference and exhibition . 1999

机译：BGA的组装可靠性和电路板光洁度的影响
5. Reliability Assessment of Solder Joint Using BGA Package: Megtron 6 Versus FR4 Printed Circuit Boards Using Drop Testing [D] . Mundhe, Pradnya 2017

机译：使用BGA封装的焊点可靠性评估：Megtron 6与FR4印刷电路板的跌落测试
6. Crystal structure of the membrane attack complex assembly inhibitor BGA71 from the Lyme disease agent Borrelia bavariensis [O] . Kalvis Brangulis, Inara Akopjana, Ivars Petrovskis, -1

机译：莱姆病病原体Borrelia bavariensis的膜攻击复合物装配抑制剂BGA71的晶体结构
7. Trend of BGACSPKGD. Board Assembly Technology and Reliability of D2BGA CSP. [O] . Nobuki HIRAYAMA 1998

机译：BGACSPKGD的趋势。 D2BGA CSP的板组装技术和可靠性。
8. Effects of microstructural heterogeneity on BGA reliability [R] . Neilsen, M. K. , Burchett, S. N. , Fang, H. E. , 1998

机译：微观结构非均匀性对BGa可靠性的影响

Assembly Reliability of BGAs and Effects of Board Finish

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