B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages

摘要

Next generation "More than Moore" integrated circuit (IC) technology will rely increasingly on the benefits attributable to advanced packaging (www.itrs.net [1]). In these increasingly heterogeneous systems, the individual semiconductor die is becoming much thinner (25 to 50 mu m, typically) and multiple dies can be stacked upon each other. It is difficult to assess non-destructively, non-invasively and in situ the stress or warpage of the semiconductor die inside these chip packages and conventional approaches tend to monitor the warpage of the package rather than the die.