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机译:硅悬臂阵列,带有用于微机IC测试探针卡的旁路金属直通硅(TSV)尖端
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,865 Changning Road, Shanghai 200050, China;
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,865 Changning Road, Shanghai 200050, China;
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,865 Changning Road, Shanghai 200050, China;
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,865 Changning Road, Shanghai 200050, China;
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences,865 Changning Road, Shanghai 200050, China;
micromachining; probe card; wafer-level IC testing; silicon cantilever; electroplating;
机译:通过直接探测测试3-D IC硅通孔(TSV)
机译:硅镍复合微加工技术的微悬臂探针卡,用于晶圆级老化测试
机译:带有硅悬臂的金属探针的制造,用于基于探针的铁电数据存储及其耐久性实验
机译:通过晶圆电互连和高度密集均匀的硅探针尖尖同时形成硅悬臂探头卡
机译:包含硅通孔(TSV)的三维互连的热机械可靠性。
机译:在分批制造过程中将尖锐的氮化硅尖端集成到高速SU8悬臂中
机译:微加工的硅悬臂和扫描探针显微镜的技巧