一种多链式结构的3D-SIC过硅通孔(TSV)容错方案

摘要

People are gradually pay attention to the Three-Dimensional(3D) Circuits owing to its higher density, higher ratio and lower power. Now Through Silicon Via (TSV) is the main issue to provide the communication links between the vertical dies in 3D Circuits. However, there will be some failure TSV owing to the limitation of manufacturing, and a failed TSV will cause the modules or the whole chip failure. A fault-tolerant scheme based on multi-chains is proposed, the TSV chain is constituted by several TSV, which makes several TSV chains reuse the redundant TSV to resume the failure chip. According to the experimental results, the entire resume ratio can be up to 90% while the number of redundant TSV and the area overheads are both dropped.%三维(3-Dimensional,3D)电路由于其更高的密度、更高的传输速率及低功耗的优点逐渐受到人们的重视和研究,而硅通孔(Through Silicon Via,TSV)技术是三维电路中互联上下层不同模块的主要方法之一.然而由于制造工艺水平的限制,在芯片制作完成后会出现一些失效TSV,这些失效TSV会导致由其互联的模块失效甚至整个芯片的失效.提出了一种多链式的硅通孔容错方案,通过将多个TSV划分为一个TSV链,多个TSV链复用冗余TSV的方法修复失效TSV.通过相关实验显示,该方案在整体修复率达到90％以上的情况下可以较大地减少冗余TSV增加的个数和面积开销.