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THROUGH-SILICON VIA (TSV) FAULT-TOLERANT CIRCUIT, METHOD FOR TSV FAULT-TOLERANCE AND INTEGRATED CIRCUIT (IC)
THROUGH-SILICON VIA (TSV) FAULT-TOLERANT CIRCUIT, METHOD FOR TSV FAULT-TOLERANCE AND INTEGRATED CIRCUIT (IC)
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机译:通过硅通孔(TSV)容错电路,TSV容错和集成电路(IC)的方法
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摘要
An integrated circuit with a through-silicon via (TSV) fault-tolerant circuit, a TSV fault tolerance method are disclosed. The IC may include a plurality of operational TSVs, a spare TSV, a plurality of fault-tolerance control modules each coupled to one of the plurality of operational TSVs and the spare TSV, and a decoder coupled to the fault-tolerance control modules. The fault-tolerance control modules may be configured to deactivate an operational TSV that is determined to be defective and activate the spare TSV based on a positioning code for the defective operational TSV from the decoder. The IC may reduce the defect rate in the fabrication of TSV-based three-dimensional (3D) IC chips.
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