首页> 外国专利> CANTILEVER-TYPE PROBE CARD AND METHOD FOR MANUFACTURING THE SAME USING SILICON MICROMACHINING TECHNOLOGY

CANTILEVER-TYPE PROBE CARD AND METHOD FOR MANUFACTURING THE SAME USING SILICON MICROMACHINING TECHNOLOGY

机译:悬臂式探针卡及其利用硅微加工技术制造相同探针的方法

摘要

PURPOSE: A cantilever-type probe card and a fabricating method thereof are provided to separate easily signals and narrow the pitch between tips and improve mechanical characteristics of the tips by using a fine processing method to form a probe tip. CONSTITUTION: A cantilever-shaped probe card includes a first silicon layer, an insulating layer, a second silicon layer, a conductive layer, a PCB, and a metal line. The first silicon layer(111) includes a spring part(117) and a front tip part(119). The spring part is made up of silicon. The front tip part is connected to one side of the spring part. The insulating layer(112) is formed at an edge of the silicon layer. The second silicon layer(113) is formed on the insulating layer. The conductive layer(129) is formed at a through-hole(123). The PCB(200) is electrically connected to the conductive layer in the second silicon layer. The metal line(201) is formed at the front tip part and the spring part in order to be electrically connected to the conductive layer in the first silicon layer.
机译:目的:提供一种悬臂式探针卡及其制造方法,以通过使用精细处理方法形成探针尖端来容易地分离信号并缩小尖端之间的间距并改善尖端的机械特性。组成:悬臂状的探针卡包括第一硅层,绝缘层,第二硅层,导电层,PCB和金属线。第一硅层(111)包括弹簧部(117)和前端部(119)。弹簧部分由硅制成。前尖端部分连接到弹簧部分的一侧。绝缘层(112)形成在硅层的边缘处。在绝缘层上形成第二硅层(113)。导电层(129)形成在通孔(123)处。 PCB(200)电连接到第二硅层中的导电层。金属线(201)形成在前尖端部分和弹簧部分,以便电连接到第一硅层中的导电层。

著录项

  • 公开/公告号KR20040048253A

    专利类型

  • 公开/公告日2004-06-07

    原文格式PDF

  • 申请/专利权人 IC MEMS INC.;

    申请/专利号KR20020076050

  • 发明设计人 JUN GUK JIN;KIM BONG HWAN;LEE JONG HO;

    申请日2002-12-02

  • 分类号G01R1/067;

  • 国家 KR

  • 入库时间 2022-08-21 22:48:49

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