Micro-Deflection Methodology for Series Production Tests of MEMS Pressure Sensors

摘要

The testing of bulk pressure sensor microelectromechanical systems at the wafer level and the prediction of the pressure sensitivity performance of the finally assembled parts based on wafer-level results are permanent problems. In contrast to other solutions, we present a measurement setup and a corresponding method to predict device-specific final part pressure sensitivity performance based on the achieved wafer measurement results. The setup described uses a mechanical probe tip to excite the pressure sensor by applying a defined deflection, not a defined force to the pressure sensor membrane. [2016-0052]