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Comprehensive analysis of the deposition caused by scattered Ga ions during focused ion-beam-induced deposition

机译:聚焦离子束诱导沉积过程中由分散Ga离子引起的沉积的综合分析

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The authors report a detailed study on the deposition because of scattered Ga ions during the focused ion beam chemical vapour deposition (FIB-CVD). The scattered ions strike the surface of the substrate nearby the base of the structure being fabricated by the primary ions, and decompose the organometallic molecules adsorbed on it, leading to the broadening of the base. Such deposition is dominant up to several micron distances from the base of the nanostructures depending on the primary ion flux. During the FIB-CVD, similar deposition occurs on the surface of nearby pre-fabricated structures, situated up to a few micrometre distances from the nanostructure being fabricated. The scattered-ion-induced deposition complicates the fabrication of complex 3D structures. The authors present the parametric dependence of the deposition because of scattered Ga ions during FIB-CVD.
机译:作者报告了由于聚焦离子束化学气相沉积(FIB-CVD)过程中由于散射的Ga离子而引起的沉积的详细研究。散射的离子撞击由初级离子制造的结构的底部附近的衬底表面,并分解吸附在其上的有机金属分子,从而导致底部变宽。取决于主要离子通量,这种沉积在距纳米结构的基部多达几微米的距离内占优势。在FIB-CVD期间,附近的预制结构的表面上会发生类似的沉积,该结构与所制造的纳米结构的距离最大为几微米。散射离子诱导的沉积使复杂的3D结构的制造复杂化。作者介绍了由于FIB-CVD过程中散射的Ga离子而导致沉积的参数依赖性。

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