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Al~+ implanted 4H-SiC: improved electrical activation and ohmic contacts

机译:注入Al〜+的4H-SiC:改善了电激活和欧姆接触

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The p-type doping of high purity semi-insulating 4H-SiC by Al~+ ion implantation and a conventional thermal annealing of 1950 ℃/5 min has been studied for implanted Al concentration in the range of 1 ×10~(19) - 8×10~(20 cm~(-3) and 0.36 μm thickness of the implanted layer. Sheet resistance in the range of 1.6×10~4 to 8.9 ×10~3 Ω , corresponding to a resistivity in the range of 4.7 x 10"1 to 2.7 ×10~(-2) Ωcm for increasing Al concentration have been obtained. Hall carrier density and mobility data in the temperature range of 140 - 600 K feature the transition from a valence band to an intra-band conduction for increasing Al concentration. In addition, the specific contact resistance of Ti/Al contacts on the 5 ×10~(19) cm~(-3) Al implanted specimen features a thermionic field effect conduction with a specific contact resistance in the 10~(-6) Ωcm~2 decade.
机译:研究了Al〜+离子注入对高纯度半绝缘4H-SiC的p型掺杂和常规的1950℃/ 5 min的热退火过程,得到的Al浓度范围为1×10〜(19)-注入层的厚度为8×10〜(20 cm〜(-3),厚度为0.36μm。薄层电阻为1.6×10〜4至8.9×10〜3Ω,对应的电阻率为4.7 x已获得用于增加Al浓度的10“ 1至2.7×10〜(-2)Ωcm。在140-600 K的温度范围内,霍尔载流子密度和迁移率数据具有从价带到带内导通的跃迁此外,在5×10〜(19)cm〜(-3)的Al注入样品上,Ti / Al接触的比接触电阻具有热电子场效应传导,比接触电阻在10〜( -6)Ωcm〜2个十进制。

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