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Model to explain the behavior of 2DEG mobility with respect to charge density in N-polar and Ga-polar AlGaN-GaN heterostructures

机译:用于解释2DEG迁移率相对于N极性和Ga极性AlGaN-GaN异质结构中电荷密度的行为的模型

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摘要

There are three possible ways of reducing the charge density (n_s) in the N-polar high electron mobility transistors (HEMT) structures, by decreasing the channel thickness, applying reverse gate bias, or modifying the back-barrier. Understanding the behavior of 2DEG mobility as a function of n_s is essential to design high performance HEMT devices. Experimental data show that in the N-polar HEMT structures, the 2DEG mobility reduces as the n_s decreases by applying reverse gate bias or decreasing channel thickness, whereas in the Ga-polar HEMT structures, the 2DEG mobility increases as the n_s in the channel decreases by applying reverse gate bias. In this paper, the 2DEG mobility as a function of n_s is calculated in N-polar HEMTs for three different aforementioned cases, and is compared to that in the Ga-polar HEMT structures. It is shown that the conventional scattering mechanisms cannot explain these different behaviors. Two new scattering mechanisms, such as scattering from charged interface states and surface state dipoles (SSD), are introduced. It is revealed that in N-polar HEMT structures, reducing n_s by applying reverse gate bias or decreasing channel thickness moves the charge centroid closer to the AlGaN-GaN interface. A combination of lower charge density (less screening of the scattering potential) and smaller distance between charge centroid and charged states at the interface leads to a severe mobility degradation in these cases. In contrast, reducing n_s by modifying the back-barrier (decreasing back-barrier doping and/or decreasing AlGaN composition) in N-polar HEMT structures moves the charge centroid away from the interface. This behavior is similar to that in the Ga-polar HEMT structures. Therefore, in the last two mentioned cases, the 2DEG mobility first increases slightly as the n_s decreases, and decreases slightly at very low charge densities. It is also shown that SSDs have large impact on the 2DEG mobility only in the N-polar (Ga-polar) HEMTs with thin channels (barriers).
机译:通过减小沟道厚度,施加反向栅极偏置或修改背势垒,可以采用三种可能的方式来降低N极高电子迁移率晶体管(HEMT)结构中的电荷密度(n_s)。了解2DEG移动性与n_s的函数关系对于设计高性能HEMT器件至关重要。实验数据表明,在N极HEMT结构中,通过施加反向栅极偏置或减小沟道厚度,随着n_s的减小2DEG迁移率降低;而在Ga极HEMT结构中,随着沟道中n_s的减小2DEG迁移率增加通过施加反向栅极偏置。在本文中,针对上述三种不同情况,在N极HEMT中计算了2DEG迁移率随n_s的变化,并与Ga极HEMT结构中的2DEG迁移率进行了比较。结果表明,传统的散射机制无法解释这些不同的行为。引入了两种新的散射机制,例如从带电界面态和表面态偶极子(SSD)散射。揭示了在N极HEMT结构中,通过施加反向栅极偏置或减小沟道厚度来减小n_s,会使电荷质心更靠近AlGaN-GaN界面。在这些情况下,较低的电荷密度(较少的散射电势屏蔽)以及界面上的电荷质心和带电状态之间的距离较小会导致严重的迁移率降低。相反,通过修改N极HEMT结构中的背势垒(减少背势垒掺杂和/或减少AlGaN成分)来减小n_s会使电荷质心远离界面。此行为类似于Ga极HEMT结构中的行为。因此,在最后提到的两种情况下,2DEG迁移率首先随着n_s的减小而略有增加,而在非常低的电荷密度下则略有下降。还显示,SSD仅在具有薄通道(势垒)的N极(Ga极)HEMT中对2DEG移动性产生重大影响。

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  • 来源
    《Journal of Applied Physics》 |2016年第11期|115302.1-115302.9|共9页
  • 作者单位

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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