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Diagnostics of expanding mesoplasmas originated from a miniaturized inductively coupled plasma and their application to Si etching

机译:源自小型感应耦合等离子体的中晶膨胀诊断及其在硅蚀刻中的应用

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摘要

A miniaturized inductively coupled plasma (m-ICP) was generated at atmospheric pressure and introduced into an expansion chamber at a reduced pressure ranging from 10 to 1000 Pa to produce expanded mesoplasmas. The fundamental parameters of the m-ICP and the downstream mesoplasma were investigated by optical emission spectroscopy and Langmuir probe measurement. When the m-ICP entered the expansion chamber, it diffused into the surrounding area and the electron density decreased from 10~(13) to 10~9-10~(10)cm~(-3). Furthermore, Si etching in mesoplasmas was performed by adding SF_6 to Ar plasmas. By changing the gas pressure, anisotropic etching with a vertical-to-horizontal etch rate ratio of 2.5 was achieved at 60 Pa with a vertical etch rate of 2.7 μm/min. In addition, the anisotropy was improved to 8 by introducing 10 sccm H_2 into the Ar/SF_6, which is ascribed to the reduction of sidewall undercutting resulting from the scavenging effect of fluorine atoms by atomic H.
机译:在大气压下生成了一个小型的电感耦合等离子体(m-ICP),并在10至1000 Pa的减压范围内将其引入了膨胀室,以产生膨胀的介电质。通过光发射光谱法和Langmuir探针测量研究了m-ICP和下游中膜的基本参数。当m-ICP进入膨胀室时,它扩散到周围区域,电子密度从10〜(13)降至10〜9-10〜(10)cm〜(-3)。此外,通过向Ar等离子体中添加SF_6来进行中晶中的Si蚀刻。通过改变气压,以60μPa的垂直蚀刻速率为2.7μm/ min实现了垂直蚀刻与水平蚀刻比率为2.5的各向异性蚀刻。此外,通过向Ar / SF_6中引入10 sccm H_2将各向异性提高到8,这归因于减少了由于原子H对氟原子的清除作用而导致的侧壁底切。

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  • 来源
    《Japanese journal of applied physics》 |2014年第3s2期|03DB03.1-03DB03.4|共4页
  • 作者单位

    Department of Bioengineering, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan;

    Department of Bioengineering, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan;

    Department of Bioengineering, Graduate School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan;

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