Electrical Test Structure for the Measurement of Hermeticity in Electronic and MEMS Packages With Small Cavity Volumes

摘要

The design, fabrication, and characterization of a piezoresistive membrane deflection test structure for the electrical evaluation of hermeticity in low cavity volume packages is discussed. This test structure uses the zero-level silicon cap as a deflecting membrane to electrically monitor changes in package cavity pressure over time. The hermeticity of the package can then be determined in real-time and low leak rates can be measured using a pressurization stage, which also accelerates the test. The minimum detectable leak rate of the test structure without acceleration has been measured at $6.9times,10^{-12}~{rm atm}cdot{rm cm}^{3}cdot{rm s}^{-1}$, which is two orders of magnitude lower than the limit of a traditional helium fine leak test.