首页>
外国专利>
Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
展开▼
机译:MEMS结构与电子器件在密封腔中的垂直集成
展开▼
页面导航
摘要
著录项
相似文献
摘要
A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.
展开▼