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Impact of Gate-to-Source/Drain Overlap Length on 80-nm CMOS Circuit Performance

机译:栅极至源极/漏极重叠长度对80nm CMOS电路性能的影响

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In this paper, we perform rigorous mixed-mode simulations on two-stage inverter circuit and sample-hold circuits, representative of digital, and analog applications, respectively. The impact of gate-source/drain overlap length on circuit performance in an 80-nm CMOS circuit is evaluated by varying the overlap length between 0 to 20 nm, while keeping the subthreshold leakage current constraint at 1,10, and 100 nA/μm. Process variations about the nominal overlap length have also been accounted for. The stage delay and switch error are used as the performance metrics. The lateral peak electric field is used as the metric for the hot carrier reliability. It is demonstrated that the overlap length should be made as small as possible, in spite of the increase in series resistance, in order to get the best circuit performance and reliability.
机译:在本文中,我们分别对两级逆变器电路和采样保持电路进行严格的混合模式仿真,分别代表数字和模拟应用。通过在0至20 nm之间改变重叠长度,同时将亚阈值泄漏电流约束保持在1,10和100 nA /μm,评估了栅极-源极/漏极重叠长度对80nm CMOS电路中电路性能的影响。 。还考虑了关于标称重叠长度的工艺变化。级延迟和开关误差用作性能指标。横向峰值电场用作热载流子可靠性的度量。已经证明,尽管串联电阻增加了,但是也应该使重叠长度尽可能地小,以便获得最佳的电路性能和可靠性。

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