The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples

摘要

Today, flex-on-board (FOB) attachments are commonly used in a variety of applications. By using anisotropically conductive adhesives (ACAs), low-cost flex materials that could not withstand typical soldering temperatures can be utilized. This paper examines the effect of manufacturing process parameters on the peel strength of a FOB assembly with an ACA attachment. The effects of bonding time and temperature on the curing properties of the ACA were also studied. The mechanical strength of the assembly was studied using a 90 $^{circ}$ peel strength test. The results showed that, by elevating curing temperature, better peel test results were obtained due to the higher degree of cure of the ACA. Additionally, longer curing time increased the peel strength. However, it also caused a considerably higher deviation in the results. Failure analysis using scanning electron microscopy showed that, with a higher degree of curing, the failure location in the peel strength test changed from the flex–adhesive interface toward the adhesive–substrate interface.