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Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength

机译：各向异性导电胶膜的粘接参数与剥离强度

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Xu Chen; Jun Zhang; Chunlei Jiao; Yanmin Liu;
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1. Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength [J] . Xu Chen, Jun Zhang, Chunlei Jiao, Key Engineering Materials . 2005 ,第Pt2期

机译：各向异性导电胶膜的粘结参数及剥离强度
2. The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples [J] . Kiilunen J. Device and Materials Reliability, IEEE Transactions on . 2012 ,第2期

机译：粘接温度和固化时间对各向异性导电薄膜板上挠性样品剥离强度的影响
3. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature [J] . Y.C. Chan, D.Y. Luk Microelectronics & Reliability . 2002 ,第8期

机译：键合参数对柔性倒装芯片封装组件各向异性导电胶互连件可靠性性能的影响I.不同键合温度
4. Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength [C] . Xu Chen, Jun Zhang, Chunlei Jiao, Asian Pacific Conference on Fracture and Strength . 2005

机译：各向异性导电粘合膜的粘合参数和剥离强度
5. Twenty-four-hour and six-month evaluation of the shear-peel bond strengths of three types of ceramic brackets to composite resin. [D] . Carriere, Pascal. 2002

机译：三种类型的陶瓷托架与复合树脂的剪切-剥离粘合强度的二十四小时和六个月评估。
6. Influence of Embedding Fiber Optical Sensors in CFRP Film Adhesive Joints on Bond Strength [O] . Neele Grundmann, Hauke Brüning, Konstantinos Tserpes, 2020

机译：CFRP薄膜粘合接头中嵌入光纤传感器对粘结强度的影响
7. Evaluation of the delamination in a flip chip using anisotropic conductive adhesive films under moisture/reflow sensitivity test [O] . Ikeda T, Kim WK, Miyazaki N 2006

机译：在湿气/回流敏感性测试下使用各向异性导电胶膜评估倒装芯片中的分层

Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength

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