MICROCAPSULE TYPE LATENT CURING AGENT FOR EPOXY RESIN AND METHOD FOR PRODUCING THE SAME, ONE-PART EPOXY RESIN COMPOSITION, CURED PRODUCT OF EPOXY RESIN, ADHESIVE, FILM FOR BONDING, CONDUCTIVE MATERIAL, AND ANISOTROPICALLY CONDUCTIVE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a microcapsule type latent curing agent for epoxy resin highly compatible in both cold curability and stability in storage and a method for producing the same, one-pack epoxy resin composition, cured product of the epoxy resin, adhesive, film for bonding, conductive material, and anisotropically conductive material.;SOLUTION: The microcapsule type latent curing agent for epoxy resin includes: a core (B) including a major component of a compound (A) having an active hydrogen group; and a capsule provided to cover the core (B), including a compound (L) having a functional group to react with the compound (A), and an isocyanate compound (C).;COPYRIGHT: (C)2010,JPO&INPIT