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Three-dimensional numerical semiconductor device simulation: algorithms, architectures, results

机译:三维数值半导体器件仿真:算法,架构,结果

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The authors present SECOND, a program for large-scale semiconductor device simulation with truly three-dimensional grids. Since 3-D simulations necessitate large computing resources, the choice of algorithms and their implementation become of utmost importance. The authors investigated the most commonly used numerical algorithms for the solution of the classical drift-diffusion equations. The study included coupled and noncoupled point and block schemes, direct and preconditioned iterative linear solvers, and several distinct ordering and coloring techniques. Structures with regular and irregular grids were analyzed. These algorithms were compared on a variety of machines including workstations, minisupers, and supercomputers. Results of transient simulations are presented to illustrate the approach.
机译:作者介绍了SECOND,这是一个用于具有真正三维网格的大规模半导体器件仿真程序。由于3-D仿真需要大量的计算资源,因此算法的选择及其实现变得至关重要。作者研究了最常用的数值算法来求解经典的漂移扩散方程。该研究包括耦合和非耦合的点和块方案,直接和预处理的迭代线性求解器,以及几种不同的排序和着色技术。分析具有规则和不规则网格的结构。在包括工作站,minisupers和超级计算机在内的各种机器上对这些算法进行了比较。给出了瞬态仿真的结果以说明该方法。

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