首页> 美国政府科技报告 >Transient Three-Dimensional Numerical Simulation of Microelectronic Semiconductor Devices
【24h】

Transient Three-Dimensional Numerical Simulation of Microelectronic Semiconductor Devices

机译:微电子半导体器件的瞬态三维数值模拟

获取原文

摘要

A program for developing a three-dimensional transient algorithm for simulating transport in nonlinear semiconductor devices is summarized. The formulation, implementation, and testing of an algorithm for the self-consistent solution of Poisson's equation and the bipolar semiconductor drift and diffusion equations for nonlinear transport in silicon devices are addressed. Model calculations are presented for a reverse bias PN junction device with unequal cathode and anode regions. It is concluded that three-dimensional transient simulations can become a very important ingredient in computer-aided design programs of semiconductor and multiterminal devices for VLSI and VHSIC applications.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号