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Second substrate current peak and its relationship to gate-voltage dependent series resistance in submicrometre nMOS LDD transistors

机译:亚微米nMOS LDD晶体管中的第二衬底电流峰值及其与栅极电压相关的串联电阻的关系

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摘要

The occurrence of the second substrate current hump (SSCH) has been thoroughly investigated and it is well known that the lateral electric field at the source side (E/sub s/) is responsible for the appearance of the SSCH in submicrometre nMOS LDD transistors. However the fall off of the SSCH after reaching a maximum value, the so called second substrate current peak (SSCP), is not well understood and explained. Here an improved model of the lateral electric field at the source side, which explains the SSCP in terms of the dependence of the source series resistance R/sub is/ on the gate-source voltage, is introduced.
机译:已经彻底研究了第二衬底电流驼峰(SSCH)的发生,众所周知,在亚微米nMOS LDD晶体管中,源极侧的横向电场(E / sub s /)导致了SSCH的出现。然而,尚未很好地理解和解释在达到最大值之后的SSCH的下降,即所谓的第二衬底电流峰值(SSCP)。在这里,介绍了一种在源侧的横向电场的改进模型,该模型根据源串联电阻R / sub is /对栅极-源极电压的依赖性来解释SSCP。

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