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Effects of Total Dose Irradiation on the Gate-Voltage Dependence of the Noise of nMOS and pMOS Transistors

机译:总剂量辐照对nMOS和pMOS晶体管噪声的栅极电压依赖性的影响

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We have found that the room-temperature $hbox{1}/f$-noise gate-voltage and frequency dependences of pMOS transistors are affected significantly by moisture exposure and total dose irradiation. The voltage noise power spectral density $S_{rm Vd}$ is proportional to $(V_{g} - V_{t})^{-beta}$, where $V_{t}$ is the threshold voltage, $V_{g}$ is the gate voltage, and $beta$ is a measure of the gate-voltage dependence. For the pMOS devices, preirradiation $ beta$ ranges from 0.4 to 0.9, and the frequency exponent $alpha = -partialln S_{rm Vd}/partial ln f$ is greater than unity. Postirradiation, gate-voltage, and frequency dependences change significantly, with $beta gg hbox{1}$ and $alpha$ much closer to unity. For nMOS devices, preirradiation $beta geq hbox{1.6}$ and $alpha approx hbox{1}$, with little change after irradiation. We attribute these observed changes in pMOS noise to changes in the trap density and energy distribution $D_{t}(E_{f})$ of these devices. Before irradiation, $D_{t}(E_{f})$ increases toward the valence band ed-nge, but after irradiation, the distribution is typically more uniform. Moreover, for some moisture-exposed devices, $S_{rm Vd} propto sim(V_{g} - V_{t})^{-3}$ after irradiation, indicating a $D_{t}(E_{f})$ that increases toward midgap. We conclude that irradiation and/or moisture exposure can greatly affect the defect energy distributions for these devices and that the observed nMOS and pMOS noise can be described by a simple trapping model with an energy-dependent trap distribution.
机译:我们发现,pMOS晶体管的室温$ hbox {1} / f $噪声门电压和频率依赖性受湿气暴露和总剂量辐照的影响很大。电压噪声功率谱密度$ S_ {rm Vd} $与$(V_ {g}-V_ {t})^ {-beta} $成比例,其中$ V_ {t} $是阈值电压$ V_ { g} $是栅极电压,而$ beta $是栅极电压依赖性的量度。对于pMOS器件,预辐射$ beta $的范围为0.4到0.9,频率指数$ alpha = -partialln S_ {rm Vd} / part ln f $大于1。辐射后,栅极电压和频率的依赖关系发生显着变化,其中$ beta gg hbox {1} $和$ alpha $更加接近统一。对于nMOS器件,预辐照$ beta geq hbox {1.6} $和$ alpharox hbox {1} $,辐照后变化很小。我们将这些观察到的pMOS噪声变化归因于这些器件的陷阱密度和能量分布$ D_ {t}(E_ {f})$。辐照前,$ D_ {t}(E_ {f})$朝价带ed-nge增加,但辐照后,分布通常更均匀。此外,对于某些暴露在水分中的设备,辐照后$ S_ {rm Vd} proto sim(V_ {g}-V_ {t})^ {-3} $,表示$ D_ {t}(E_ {f})向中间差距增加的美元。我们得出结论,辐射和/或湿气暴露会极大地影响这些器件的缺陷能量分布,并且所观察到的nMOS和pMOS噪声可以通过具有能量依赖陷阱分布的简单陷阱模型来描述。

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