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Low-temperature avalanche multiplication in the collector-base junction of advanced n-p-n transistors

机译:高级n-p-n晶体管的集电极-基极结中的低温雪崩倍增

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The collector-base junction avalanche in advanced n-p-n transistors in the temperature range of 293 to 83 K is described. The multiplication factor is shown to increase exponentially with decreasing temperature. The dependence decreases with increased collector doping concentration and, for the same device, with increased reverse bias. At a fixed collector bias, it is roughly constant at low current density, but varies with I/sub c/ at high-level injection due to space-charge modulation. Measurements at low temperatures excluded self-heating in the devices, and it was possible to study high-level injection effects at collector current densities higher than 10 mA/ mu m/sup 2/. Extensive computer simulations were performed to study the effects of the field and carrier distributions. It was observed that, at very high current densities, when the injected carrier density in the collector junction exceeds 1*10/sup 17/ cm/sup -3/, there is an anomalous drop in the avalanche multiplication rate that conventional device simulators fail to predict. The latter is attributed to electron-electron scattering that retards impact ionization by quickly redistributing the excess energy through interparticle collisions.
机译:描述了在293至83 K的温度范围内先进n-p-n晶体管中的集电极-基极结雪崩。结果表明,随着温度的降低,倍增因子呈指数增加。依赖关系随着集电极掺杂浓度的增加而降低,而对于同一器件,反向偏压则增加。在固定的集电极偏置下,它在低电流密度下大致恒定,但由于空间电荷调制,在高电平注入时随I / sub c /变化。低温下的测量排除了器件中的自热,并且有可能研究集电极电流密度高于10 mA /μm / sup 2 /时的高水平注入效应。进行了广泛的计算机模拟,以研究场和载流子分布的影响。观察到,在非常高的电流密度下,当集电极结中注入的载流子密度超过1 * 10 / sup 17 / cm / sup -3 /时,雪崩倍增率会出现异常下降,这是常规设备模拟器无法实现的进行预测。后者归因于电子-电子散射,该电子-电子散射通过粒子间碰撞迅速重新分配多余的能量,从而延迟了碰撞电离。

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