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首页> 外文期刊>IEEE Transactions on Electron Devices >Measurement of collector-base junction avalanche multiplication effects in advanced UHV/CVD SiGe HBT's
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Measurement of collector-base junction avalanche multiplication effects in advanced UHV/CVD SiGe HBT's

机译:在先进的UHV / CVD SiGe HBT中测量集电极-基极结雪崩倍增效应

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This paper presents measurements of the avalanche multiplication factor (M-1) in SiGe HBTs using a new technique capable of separating the avalanche multiplication and Early effect contributions to the increase of collector current with collector-base bias, as well as allowing safe measurements at practical current densities. The impact of collector doping, current density, Ge profile, and operation temperature are reported for the first time using measured and simulated results from a production quality UHV/CVD SiGe HBT technology. Limitations of the technique in the presence of significant self-heating are discussed. By turning on the secondary hole impact ionization, we revealed the difference in impact ionization between strained SiGe and Si in the presence of the "dead space" effect. Despite its smaller bandgap, the compressively strained SiGe layer shows an apparent decrease in the secondary hole impact ionization rate compared to Si.
机译:本文介绍了使用一种新技术对SiGe HBT中雪崩倍增因子(M-1)的测量,该技术能够分离雪崩倍增和早期效应对集电极基极偏压对增加集电极电流的贡献,并允许在实际电流密度。利用生产质量的UHV / CVD SiGe HBT技术的测量结果和模拟结果,首次报告了集电极掺杂,电流密度,Ge分布和工作温度的影响。讨论了在存在明显的自热的情况下该技术的局限性。通过打开次级空穴碰撞电离,我们揭示了在存在“死角”效应的情况下应变SiGe和Si之间碰撞电离的差异。尽管其带隙较小,但与Si相比,压缩应变的SiGe层显示出次级空穴冲击电离速率的明显降低。

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